专利内容由知识产权出版社提供
专利名称：SUBSTRATES INCLUDING OPTOELECTRONIC
COMPONENTS
发明人：Maziar Amirkiai,Yunpeng Song,Peter Henry
Mahowald,Hongyu Deng
申请号：US14923037申请日：20151026
公开号：US20160050775A1公开日：20160218
专利附图：
摘要：This disclosure generally relates to high-speed fiber optic networks that uselight signals to transmit data over a network. The disclosed subject matter includes
devices and methods relating to header subassemblies and/or optoelectronicsubassemblies. In some aspects, the disclosed devices and methods may relate to aheader subassembly that can include: a substrate with a substrate top and a substratebottom; at least one optoelectronic transducer on the substrate top; at least one topelectrical component on the substrate top, the electrical component can be operablycoupled with the optoelectronic transducer; and at least one bottom electrical
component on the substrate bottom, the bottom electrical component can be operablycoupled with the optoelectronic transducer.
申请人：FINISAR CORPORATION
地址：Sunnyvale CA US
国籍：US
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