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专利名称：FORMING MOLD, AND MOLDING METHOD发明人：KIYOMI, Hidenori,KIYOMI, Shigeaki申请号：EP08827821.3申请日：20080813公开号：EP2184150A4公开日：20171108
摘要：A molding die is mainly constituted of a die surface shell layer (15) having a diesurface (32) responsive to the shape of a composite item and a support (16) supportingthe die surface shell layer (15). The die surface shell layer (15) is made of a materialhaving air permeability, and a prepreg material (34) is placed on a die-shaped surface (32)thereof. Then, the prepreg material (34) is covered with a nonpermeable vacuum bag film(35), and a cavity portion (30) of the support (16) is evacuated. The die surface shell layer(15) has air permeability, whereby it follows that air present on the die-shaped surface(32) is also discharged into the cavity portion (30) through the die surface shell layer (15).Consequently, the prepreg material (34) is pressed against the die-shaped surface (32) bythe atmospheric pressure outside the vacuum bag film (35), and strongly adheres.
申请人：Seiei Co., Ltd.
地址：4-3-1314 Manabigaoka 3-chome Tarumi-ku Kobe-shi Hyogo 655-0004 JP
国籍：JP
代理机构：Faulkner, Thomas John
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