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专利名称：Process for sensitizing articles for
metallization and resulting articles
发明人：Francis J. Nuzzi,Edward J. Leech,Richard W.
Charm,Joseph Polichette
申请号：US06/080488申请日：19791001公开号：US04450190A公开日：19840522
摘要：Surfaces of articles are sensitized for the deposition of adherent metal fromelectroless metal solutions in contact therewith by prior treatment with an activatablecomplex of copper in a liquid medium formed from a solution comprising a mixture ofhalogen, cuprous and cupric components and thereafter forming a deposit on thetreated article surfaces of a water-insoluble derivative of the said complex. Such surfacedeposits are treated with a reducing agent or water to enhance their reception of metalin an electroless metal deposition bath.
申请人：KOLLMORGEN TECHNOLOGIES CORPORATION
代理机构：Morgan, Finnegan, Pine, Foley & Lee
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